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March 9th, 2014

Welcome to the Home of the IEEE Santa Clara Valley Women in Engineering!

March 31st, 2014

Disaster Response Communications: What Works & What Doesn’t. Are you ready?

 

Date and Time: Thursday April 10, 2014 at 6-8pm

Registration, Pizza, Cookies & Drinks, Networking: 6-6:45 pmCatherine_Nelson  Presentation: 6:45-7:45 pm

SpeakerCatherine Blackadar Nelson of Intel and GHTC

VenueSanta Clara UniversityFrugal Innovation Lab
Frugal Innovation Lab is on the bottom floor of the Bannan  Engineering Lab building
Map to: Santa Clara Univ. Frugal Innovation Lab with parking

Sponsor: IEEE SCV Special Interest Group for Humanitarian Technology (SIGHT)
Co-Sponsor: IEEE-SCV-WiE

Cost: $12 for IEEE members, $15 for Public, $5 for students, retirees, and unemployed

Eventbrite

Click here for Eventbrite Registration 

 

 

Talk Summary:  Learn about deploying mission critical networks for humanitarian and disaster response communications. The presentation will cover current challenges with disaster communications. It will showcase the different types of technologies used from networks, to radio, voice, video and  social media as well as best practices and pitfalls. There will be real case examples from Haiti, Katrina, Sandy and others. The presentation will also cover factors beyond technology that need to be addressed in order to be effective.

About the Speaker: Catherine Blackadar Nelson is an expert in security, Internet technologies, and communications and is currently a Sr. Security Researcher at Intel.  She is also an advisor to multiple organizations, including the UN, USAID and FEMA providing guidance in Cyber security, disaster and remote communications. In addition, Catherine is involved in the development of the Rapid Technology Assessment Team Initiative launched out of the US Naval Post Graduate School, which provides communications assessments in disasters to the humanitarian community.  Her past experience includes being instrumental in building the Cisco TacOps Disaster Response Team which specialized in disaster/mobile communications, and technology solutions for austere environments. In her career, she has over 20 years’ experience in disaster response and has been involved in responses to Hurricane Katrina, the Haitian earthquake, and the Japan 2011 earthquake/tsunami.

Believing in giving back, she is the current Chair of the IEEE Global Humanitarian Technology Conference – which specializes in bringing together technologists from all over the world to share best practices. She is a member of the Anita Borg Institute’s NetHope Women’s TechConnect Mentor program.

Contact information: catherine.nelson@ieee.org | twitter:@CathBNelson

Need to drive -Parking garage is next to the Bannan Engineering Buildings:  http://www.scu.edu/map/parking/directions.cfm

How about Caltrain? Santa Clara Station is right there!  http://www.caltrain.com/stations/santaclarastation.html

 

 

March 9th, 2014

Directions in Device Packaging for Mobile Applications

 

Jan VardamanDate and Time: Thursday March. 27, 2013 at 11:30am – 1:00pm

Registration: 11:30AM

Buffet Lunch: 11:45 AM -12:15 PM ($15 if RSVP by Mar. 25th, $5 for students or unemployed, additional $5 for walk-in)

Presentation: 12:15 PM (Presentation only is free)

Venue: Biltmore Hotel, Santa Clara

Speaker: E. Jan Vardaman

Sponsors: IEEE SCV CPMT

Co-Sponsors: IEEE-SCV-WiE;

Registration  CPMT – Vardaman

Talk Summary:  Mobile Devices are driving the unit volume growth in semiconductor packaging today. Growth in wafer-level packages (WLPs) continues to be driven by the strong preference for small form factor, low profile packages. A variety of pin counts and die sizes are also found in watches, MP3 players, digital cameras, laptops and tablets.

Emerging areas such as wearable electronics will require low-cost and small form factor packages. Fan-out WLPs (FO-WLPs) are receiving increased interest for more than just single-die packages and are emerging as a new potential format for System-in-Package (SiP).

This presentation examines application trends for packages, trends in pin count, die size, and ball pitch, and discusses the challenges for today’s package designer.

About the Speaker: E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided licensing and consulting services in semiconductor packaging since 1987. She is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly.

Jan served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China. She is a member of IEEE-CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors.

Jan received her B.A. in Economics and Business from Mercer University in Macon, Georgia in 1979 and her M.A. in Economics from the University of Texas at Austin in 1981. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.

February 27th, 2014

Probing Interfacial Contact via MEMS-based Micro-instrumentation

Prof. Roya MaboudianDate: Thursday Feb. 27, 2014
Time: 11:30am – 1:00pm
Venue: Biltmore Hotel, Santa Clara
Speaker: Prof. Roya Maboudian, UCB

Sponsor: IEEE SCV CPMT
Co-Sponsors: IEEE SCV MEMS, IEEE-SCV-WiE;

 

Talk Summary:  Understanding the mechanisms underlying the interactions that occur when two surfaces are brought together, separated, or rubbed against each other is fundamentally important to many basic and applied problems. In this presentation, I will discuss the impact of these interactions in the burgeoning field of micro- and nano-electromechanical systems. I will also present the unique opportunities provided by the MEMS processing techniques to interrogate surfaces on a length scale not easily accessible by other techniques, namely in the mesoscopic length scale. With this view, I will introduce a number of MEMS-based microinstruments that we have developed to study these interactions, and some of the insights we have gained using them about the nature of surface interactions involved in M/NEMS.

About the Speaker: Roya Maboudian is professor of chemical and biomolecular engineering, associate director of the Center of Integrated Nanomechanical Systems (COINS), and faculty affiliate of the Berkeley Sensor & Actuator Center (BSAC) at the University of California, Berkeley. She received her B.S. degree in Electrical Engineering from the Catholic University of America, Washington, D.C., and her M.S. and Ph.D. degrees in Applied Physics from the California Institute of Technology in Pasadena. Prof. Maboudian’s research interest is in the surface and materials science and engineering of micro/nanosystems. The main research activities in her group currently include investigation of the tribological issues in micro/nanoelectromechanical systems (M/NEMS) and surface interactions in microfluidic environments; silicon carbide-based sensors for harsh environment applications; nanowire- and graphene-based sensors and energy technologies; development of electrochemical processes for low-cost thin-film photovoltaics; and biologically inspired materials design. Prof. Maboudian is the recipient of several awards, including the Presidential Early Career Award for Scientists and Engineers (PECASE) from the White House, NSF Young Investigator award, and the Beckman Young Investigator award. She is currently serving as editor to the IEEE Journal of Microelectromechanical Systems (JMEMS), as associate editor to IEEE/SPIE Journal on Micro/Nanolithography, MEMS and MOEMS (JM3), and as advisory board member to ACS Applied Materials and Interfaces (AMI).

Check http://ieee-wie-scv.org/   for the latest information!

 

 

February 6th, 2014

How to Grow Stronger Through Rapid Changes in Technology

Stanford University logoDate/Time: Thursday February 6th, 2014, 6:00pm-8:15pm
Cost: Free
Place: Stanford University
Paul Allen Ct. For Integr Sys Annex (04-055)
330 Serra Mall (CIS-X auditorium)

Stanford Campus Map

Questions: Susan Delafuente (sdelafuente@ieee.org)

 

You are invited to attend the IEEE Women in Engineering Executive Fireside Chat. In order for women to become authentic leaders in the rapidly changing world of technology today, they need the ability to communicate effectively, to make meaningful connections and to identify a course of action to maximize their performance.

Speaker/Panelist #1 Biography:

Rox Roxsana Hadjizadeh is an IEEE Sr. Member, IEEE Santa Clara Valley Section (SCV) WIE co-founder, 2006-2012 SCV WIE Chair, and the 2013 /2014 SCV WIE Sr. Advisor. In 2009, she served as IEEE SCV Section Chair and also as Secretary, Treasurer and Vice Chair of the SCV Section. She is an IEEE Spectrum Media Group advisor and has included Tesla Motors and Cisco Systems in a number of IEEE events from 2007 thru 2011. Roxsana holds a BSEE and MSEE degrees and is currently IoTBU New Product Program Manager focusing on new Hardware and Software security products at Cisco Systems. Her past professional experience includes:  Senior Staff Engineer, Manager and Director at various Silicon Valley companies including GENUS Inc., PRIAM, Network Computing Devices, WinCom Systems, Quantum 3D and Tesla Motors. Roxsana is a member of Cisco’s iWise (Inspiring Women through Information Sharing and Experiences), WISE (Women in Science and Engineering), Connected Women, and Women in Technology. Roxsana loves giving back to society, is an active member in many charity events such as Second Harvest Food Bank, Habitat for Humanity, RAFT (Resource Area for Teaching), and March of Dimes for babies and she is also leading a team of university students for SVIJ (Silicon Valley Innovation Jam) events at Cisco.

Speaker/Panelist #2 Biography:

Ingrid_GavshonIngrid Gavshon works with clients in the United States, the Middle East, Mongolia, Russia and South Africa. She believes coaching allows clients to create a shared thinking environment to effectively achieve their personal and professional goals, by identifying their strengths, recognizing obstacles to success and, as a team, helps the coached fulfill their potential . Ingrid is an Executive Coach and a member of the Berkeley Executive Coaching Institute Leadership and Communications team. She is an award-winning filmmaker who has made a number of documentary films including  13 films about Nelson Mandela. Ingrid is a co-facilitator of the Peterson Caterpillar Brand Ambassador Program and is a guest faculty member at the Haas School of Business at UC Berkeley EWMBA, UCLA, UC Berkeley Center for Executive Education. Gavshon’s clients include:  Adobe, Cisco Systems, Cypress Semiconductors, Lawrence Berkeley National Laboratory, Qualcomm, Advanced Technology Investment Company (ATIC) Abu Dhabi, Peterson Caterpillar, the RL Consulting Group in the USA and KC Alternative Health Services in the UK.

Speaker/Panelist #3 Biography:

Joanne OleckoJoanne Olecko is a Sr. Field Clinical Engineer at Boston Scientific Neuromodulation and a IEEE Santa Clara Valley Section (SCV) WIE co-founder. She holds degrees in BSc. Electrical Engineering and MSc Biomedical Engineering (Neroengineering Track). Joanne is a biomedical engineer with a passion for neurology and signals, working in the field of neuromodulation. She provides engineering and clinical research support for medical devices that stimulate the central nervous system. She specializes in Neuroengineering, DSP (Digital Signal Processing); sales/field engineering training and support; clinical research; technical marketing: and electronics system architecture.

 

Speaker/Panelist #4 Biography:

Kimara ChinKimara Chin is a Materials Engineering Manager at Trimble Navigation and a IEEE Santa Clara Valley Section (SCV) WIE co-founder. She holds degrees in BSc – Electrical and Computer Systems Engineering and MBA – Technology Management. Kimara held past positions as a Manager of the CAD/PCB Layout and Mechanical CAD department, Manager of the Component Engineering department, Sr. Engineer, and Hardware Engineer. Kimara pioneered EU RoHS implementation and is currently in a special project which in

January 7th, 2014

HTML5: Programming the Compute Continuum

HeidiPan1

Tuesday, January 07, 2014 7:00 PM

Agilent Technologies, Inc. – Aristotle Room, Bldg. 5 
5301 Stevens Creek Blvd., Santa Clara, CA 95051

Heidi’s LinkedIn Site

HTML5 is emerging as a compelling programming platform by providing rich OS-like features, high developer productivity and cross-platform reach. We are at an inflection point today, where the performance and feature advances in HTML5 technologies, combined with increasing device and OS fragmentation, are fueling the adoption of the web as a platform of choice across the compute continuum.

This talk will provide a high-level technical primer of client-side web technologies that serve as the foundation for HTML5.

About the Speaker: Heidi Pan is a Staff Engineer in the Technology Pathfinding and Innovation team in Intel’s Software and Services Group. She has been investigating and prototyping mobile and web developer technologies since September 2010.
Heidi currently leads an HTML5 runtime performance pathfinding project. She received her PhD in Computer Science from MIT for her research on parallel programming models.
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